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AMKOR Technology bond | 6.63% 2027-09-15 USD | USU03169AM81

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Overview

pricing as of 2025-11-28
6.58
6.625
100.069
2027-09-15
USD
100.625/98.801

Analytics

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Bond Information

Issue Type
XXXX
Country
United States
Industry
XXXX
Region
XXXX
Maturity Date
2027-09-15
Par Value
2000
Callable
XXXX
Next Call Date
XXXX
Call Type
XXXX
Call Price (%)
XXXX
Series
XXXX
Class
XXXX
Maturity Structure
XXXX
Amount Outstanding (mil)
525.00

Coupon Information

Coupon
6.625
Coupon Type
XXXX
Coupon Frequency
XXXX
First Coupon Date
XXXX
Last Coupon Date
XXXX

Risk Information

Sinking Fund
XXXX
Security
XXXX
Subordination
XXXX
Debt Type
XXXX

Issuance Information

Issue Date
XXXX
Dated Date
XXXX
Issue Size (mil)
525
Min. Piece
XXXX
Min. Increment
XXXX

About the AMKR 6.63% 2027-09-15 USD bond (USU03169AM81)

This AMKOR Technology Inc. corporate note has a X.X % fixed rate coupon paid on a XXXX basis. It was issued on MAR 12, 2000 with an issue size of XXX million USD and matures on DEC 9, 2000 with a last coupon date of FEB 28, 2020.

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AMKR 5.88% 2033-10-01 USD

USU03169AN64

Pays a 5.875% coupon and matures on October 01, 2033.

99.82 USD▼ -0.20

AMKR 6.63% 2027-09-15 USD

US031652BK50

Pays a 6.625% coupon and matures on September 15, 2027.

100.07 USD

About the issuer AMKOR Technology Inc.

AMKOR Technology Inc., founded in 1968 and headquartered in Tempe, Arizona, is a leading provider of semiconductor packaging and test services. The company specializes in advanced packaging solutions for the semiconductor industry, offering a comprehensive range of services from design to manufacturing.