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Telekom Malaysia Bhd bond | 7.88% 2025-08-01 USD | US87942UAC53

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Overview

pricing as of 2025-08-01
0.00
7.875
100.000
2025-08-01
USD
100.124/99.993

Analytics

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Bond Information

Issue Type
XXXX
Country
Malaysia
Industry
XXXX
Region
XXXX
Maturity Date
2025-08-01
Par Value
100000
Callable
XXXX
Next Call Date
XXXX
Call Type
XXXX
Call Price (%)
XXXX
Series
XXXX
Class
XXXX
Maturity Structure
XXXX
Amount Outstanding (mil)
300.00

Coupon Information

Coupon
7.875
Coupon Type
XXXX
Coupon Frequency
XXXX
First Coupon Date
XXXX
Last Coupon Date
XXXX

Risk Information

Sinking Fund
XXXX
Security
XXXX
Subordination
XXXX
Debt Type
XXXX

Issuance Information

Issue Date
XXXX
Dated Date
XXXX
Issue Size (mil)
300.00000
Min. Piece
XXXX
Min. Increment
XXXX

About the TELMAL 7.88% 2025-08-01 USD bond (US87942UAC53)

This Telekom Malaysia Bhd corporate debenture has a X.X % fixed rate coupon paid on a XXXX basis. It was issued on MAR 12, 2000 with an issue size of XXX million USD and matures on DEC 9, 2000 with a last coupon date of FEB 28, 2020.

More bonds from Telekom Malaysia Bhd

TELMAL 4.68% 2028-10-31 MYR

MYBVN1803029

Pays a 4.68% coupon and matures on October 31, 2028.

102.77 MYR▲ 0.03

TELMAL 4.58% 2027-09-03 MYR

MYBVN1702411

Pays a 4.58% coupon and matures on September 03, 2027.

101.28 MYR▼ -0.02

TELMAL 7.88% 2025-08-01 USD

USY8578HAC44

Pays a 7.875% coupon and matures on August 01, 2025.

100.00 USD

About the issuer Telekom Malaysia Bhd

Telekom Malaysia Bhd, founded in 1984 and headquartered in Kuala Lumpur, Malaysia, is a leading telecommunications company dedicated to providing innovative communication solutions. The company offers a wide range of services, including broadband, data, and voice services, catering to both consumer and business markets.