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Philadelphia Authority for Industrial Development bond | 6.35% 2028-04-15 USD | US71781LAM19

Change % : ▼-0.055%

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Overview

pricing as of 2026-07-13
4.65
6.350
102.156
2028-04-15
USD
104.289/102.156

Analytics

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Bond Information

Issue Type
XXXX
Country
United States
Industry
XXXX
Region
XXXX
Maturity Date
2028-04-15
Par Value
1000
Callable
XXXX
Next Call Date
XXXX
Call Type
XXXX
Call Price (%)
XXXX
Series
XXXX
Class
XXXX
Maturity Structure
XXXX
Amount Outstanding (mil)
236.85

Coupon Information

Coupon
6.35
Coupon Type
XXXX
Coupon Frequency
XXXX
First Coupon Date
XXXX
Last Coupon Date
XXXX

Risk Information

Sinking Fund
XXXX
Security
XXXX
Subordination
XXXX
Debt Type
XXXX

Issuance Information

Issue Date
XXXX
Dated Date
XXXX
Issue Size (mil)
236.85
Min. Piece
XXXX
Min. Increment
XXXX

About the PHIDEV 6.35% 2028-04-15 USD bond (US71781LAM19)

This Philadelphia Authority for Industrial Development municipal bond has a X.X % fixed rate coupon paid on a XXXX basis. It was issued on MAR 12, 2000 with an issue size of XXX million USD and matures on DEC 9, 2000 with a last coupon date of FEB 28, 2020.

More bonds from Philadelphia Authority for Industrial Development

PHIDEV 3.96% 2026-04-15 USD

US71783DAD75

Pays a 3.964% coupon and matures on April 15, 2026.

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PHIDEV 0.00% 2026-04-15 USD

US71781LBD01

Pays a 0% coupon and matures on April 15, 2026.

100.00 USD

About the issuer Philadelphia Authority for Industrial Development

The Philadelphia Authority for Industrial Development (PAID) was established in 1958 and is based in Philadelphia, Pennsylvania. Its main purpose is to promote economic development through financing and investment strategies that support local businesses and enhance job creation. PAID primarily provides financing solutions via industrial development bonds, which cater to manufacturers and other qualifying businesses looking to expand or improve their facilities.