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CLP Power Hongkong Financing bond | 2.46% 2031-08-25 HKD | HK0000305646

Change % : ▼-0.053%

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Overview

pricing as of 2026-07-13
3.82
2.465
93.715
2031-08-25
HKD
95.54/93.464

Analytics

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Bond Information

Issue Type
XXXX
Country
British Virgin Islands
Industry
XXXX
Region
XXXX
Maturity Date
2031-08-25
Par Value
Callable
XXXX
Next Call Date
XXXX
Call Type
XXXX
Call Price (%)
XXXX
Series
XXXX
Class
XXXX
Maturity Structure
XXXX
Amount Outstanding (mil)
500.00

Coupon Information

Coupon
2.465
Coupon Type
XXXX
Coupon Frequency
XXXX
First Coupon Date
XXXX
Last Coupon Date
XXXX

Risk Information

Sinking Fund
XXXX
Security
XXXX
Subordination
XXXX
Debt Type
XXXX

Issuance Information

Issue Date
XXXX
Dated Date
XXXX
Issue Size (mil)
500.00000
Min. Piece
XXXX
Min. Increment
XXXX

About the CHINLP 2.47% 2031-08-25 HKD bond (HK0000305646)

This CLP Power Hongkong Financing Ltd. corporate bond has a X.X % fixed rate coupon paid on a XXXX basis. It was issued on MAR 12, 2000 with an issue size of XXX million HKD and matures on DEC 9, 2000 with a last coupon date of FEB 28, 2020.

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CHINLP 3.38% 2027-10-26 USD

XS0848445358

Pays a 3.375% coupon and matures on October 26, 2027.

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CHINLP 3.78% 2029-08-06 HKD

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Pays a 3.78% coupon and matures on August 06, 2029.

99.58 HKD▼ -0.09

CHINLP 3.22% 2030-03-20 HKD

HK0000241080

Pays a 3.22% coupon and matures on March 20, 2030.

97.87 HKD▼ -0.10

CHINLP 3.16% 2032-03-09 HKD

HK0000333390

Pays a 3.16% coupon and matures on March 09, 2032.

95.45 HKD▼ -0.12

CHINLP 2.13% 2030-06-30 USD

XS2193950354

Pays a 2.125% coupon and matures on June 30, 2030.

91.10 USD▼ -0.14

About the issuer CLP Power Hongkong Financing Ltd.

CLP Power Hongkong Financing Ltd., founded in Hong Kong, serves as the financing arm of CLP Group, a leading energy provider in the region. The company's primary purpose is to raise funds to support the financing activities of its parent company, focusing on energy and infrastructure projects within Hong Kong and the Asia-Pacific region.